Rogers Corporation kicked off IMS2014 with their COOLSPAN® thermally and electrically conductive adhesive (TECA) film.
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This particular substrate is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy clad metal backplanes, heat sink coins, and RF module housings.
COOLSPAN TECA can be used as an alternative to fusion bonding, sweat soldering, mechanical, or press fit metal attachment. It provides both a thermal and electrical conductive bond interface, and is supplied in sheet from on a PET carrier, which is easy to handle when converting into preforms and when peeling from the carrier.
For more information visit http://www.rogerscorp.com.