Ironwood Electronics' (Eagan, MN) PB-BGA133A-Z-01 Socket Probe Adapter allows high-speed testing of BGA devices while accessing signals using testers via header pins. Features of the PB-BGA133A-Z-01 include shortest possible trace length for maximum speed, low inductance, low capacitance, and it is blind and buried via PCB design technology. This socket probe adapter is designed to interface with 0.5 mm pitch Fine pitch Ball Grid Array (FBGA) packages. 

Ironwood's PB-BGA133A-Z-01 Socket Probe Adapter consists of two parts. The surface mount base is soldered to the target system board in place of BGA133, 0.5 mm pitch, 14 x 14 array, 11 X 10 mm body using standard BGA soldering methods. The probe board with elastomer socket plugs into the SMT base and employs a PCB to deliver all data, address, control, and clock signals to header pins on 2.54 mm centers. To use, drop IC into the elastomer socket and apply downward force using compression screw in the socket lid. Socketed 133 pin BGA chip top module will plug into the female BGA socket soldered to the development board. 

The elastomer socket (in the top module) is constructed with high performance and low inductance gold plated embedded wire on elastomer as interconnect material between device and probe board.

Specifications include:

  • Temperature range from -35 to +100 °C.
  • Pin self inductance 0.15 nH.
  • Mutual inductance 0.025 nH.
  • Capacitance to ground 0.01 pF.
  • Current capacity 2 amps per pin.

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