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The SpeedStack mezzanine connector system from Molex (Lisle, IL) provides a low profile solution for PCB space savings and a narrow body width for optimized airflow in high-speed and very dense applications. Compact SpeedStack connectors feature:

  • A stack height of 4.00mm.
  • Support data rates up to 40 Gbps per differential pair. 
  • A 0.80mm pitch, with a narrow housing design to minimize obstruction in convection air system cooling. 
  • Robust insert-molded wafer design including a protected shrouded housing. 
  • A shielding ground pin to improve electrical performance and minimize cross-talk.

For more information, visit www.molex.com

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