Rohde & Schwarz (Munich, Germany) and Samsung reached a significant milestone in the commercial implementation of LTE-Advanced by successfully verifying uplink carrier aggregation in the real form factor. The tested Samsung DUT is a 6.3 inch real form factor test device that makes the SHANNON300 the world’s first LTE-Advanced ASIC chipset to verify uplink carrier aggregation. Commercial devices with two transmission antennas are currently still a challenge. In the future, uplink carrier aggregation and uplink MIMO will be required for the demanding uplink throughput of wireless Internet services such as multi-media upload to cloud servers. Features include:
- Supports two transmissions with a single SHANNON300 baseband chipset.
- Release 10 reference implementation for downlink carrier aggregation.
- Verified implementation to test uplink carrier aggregation in LTE-FDD.
For more information, visit www.rohde-schwarz.com