Carbodeon (Finland) has developed a thermal filler using nanodiamonds that increase the conductivity of thermally conductive polymers by 25 percent, providing significant performance increases for polymers used in electronics and LED manufacture. Features include:
- A polyamide 66 (PA66) reference material containing 45 percent by weight of boron nitride as the thermal filler.
- A new material that uses 44.9 percent boron nitride and 0.1% of uDiamond nanodiamond powder.
- A thermal conductivity of diamond @ around 2000 W/mK.
For more information visit www.carbodeon.com.