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AVX Corporation (Greenville, SC) showcased its full range of MLO diplexers at the European Microwave Week Exhibition. Based on its patented multilayer organic high density interconnect technology, AVX’s MLO diplexers employ high dielectric constant and low loss materials to realize high Q printed passive elements, such as inductors and capacitors in multilayer stack ups. Features include:

  • Low profile 0805 and 0603 packages (0.6mm and 0.5mm, respectively).
  • Capable of supporting multiple wireless standards, including: WCDMA, CDMA, WLAN, and GSM.
  • Ideally suited for band switching in dual- and multiband applications, such as WiFi, WiMax, GPS, and cellular bands. 

For more information, visit www.avx.com.

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