AVX (Greenville, SC) has announced its new low-profile 0603 diplexer at the International Microwave Symposium in Seattle, Washington. Based on the company’s patented multilayer organic high density interconnect technology, the new 0603 MLO diplexer (part number: DP03B5425TTR) employs high dielectric constant and low loss materials to realize high Q passive printed elements, such as inductors and capacitors in a multilayer stack up. Capable of supporting multiple wireless standards, including: WCDMA, CDMA, WLAN, GSM, and BT, the 0603 diplexers are ideally suited for band switching in dual- and multiband applications, such as WiFi, WiMax, GPS, and cellular bands. Expansion matched to PCBs, the diplexers also provide improved reliability with regards to comparable ceramic or silicon components. Features include:
- Land grid array packaging technology.
- Inherently low profile (0.5mm).
- Low parasitics.
- High heat dissipation.
- Maximum power capacity of 4.5W.
- Rated for use in temperatures ranging from -40°C to +85°C.
For more information, please visit www.avx.com.