DELO Industrial Adhesives’ (Boston, MA) new light curing DELO-KATIOBOND product lineup has been engineered specifically for exceptionally fast seal-bonding functions in the production of microelectronics including micro switches widely used in the automobile industry. Curing to initial strength in just seconds with easy dispensability, DELO-KATIOBOND adhesives were developed as a highly reliable yet cost-effective alternative to more complex heat-curing or two-component epoxy resins and other bonding agents. DELO-KATIONBOND adhesives:
- Do not require a toxic solvent to adjust viscosity properties.
- Are solvent free.
- Require no mixing. S
- Are available with various viscosities, enabling the selection of the appropriate flow characteristic – from capillary to steady – to suit any application.
- Can be applied with various dispensing systems, or by screen printing and stencil printing for 2-dimensional application or spraying for 2- or 3-dimensional applications.
- Enable short-time heat resistant stresses up to +300°C (e. g. in soldering processes).
For more information visit email@example.com or visit www.delo-adhesives.com/us.