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DELO Industrial Adhesives’ (Boston, MA) new light curing DELO-KATIOBOND product lineup has been engineered specifically for exceptionally fast seal-bonding functions in the production of microelectronics including micro switches widely used in the automobile industry. Curing to initial strength in just seconds with easy dispensability, DELO-KATIOBOND adhesives were developed as a highly reliable yet cost-effective alternative to more complex heat-curing or two-component epoxy resins and other bonding agents. DELO-KATIONBOND adhesives:

  • Do not require a toxic solvent to adjust viscosity properties.
  • Are solvent free.
  • Require no mixing. S
  • Are available with various viscosities, enabling the selection of the appropriate flow characteristic – from capillary to steady – to suit any application.
  • Can be applied with various dispensing systems, or by screen printing and stencil printing for 2-dimensional application or spraying for 2- or 3-dimensional applications.
  • Enable short-time heat resistant stresses up to +300°C (e. g. in soldering processes).

For more information visit press@delo.de or visit www.delo-adhesives.com/us.

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