ProTek Devices announced a new business line currently targeted at LED lighting manufacturers. The product line consists of individual unpackaged die available in wafer form. The die in wafer form are available as unidirectional and bidirectional electrostatic discharge (ESD) protection diodes. ProTek Devices' new LED die solutions meet various LED lamp manufacturing needs. In addition to LED lighting manufacturers, other applications include digital display boards; automotive LEDs; backlight LEDs and solid-state lighting.

The new LED die is provided with a thickness of < 6 mils and support LED lighting voltage at 5V. Other voltages will be introduced soon. ProTek Devices' chip scale product line for LED lighting applications include the bidirectional PLED508 and PLED511 die and the unidirectional PLED508U and PLED511U. They are all available as probed good die in wafer form. The wafers are delivered quartered, sawn and mounted on blue tape.

Wafer die technical details

The bidirectional PLED508 size is 7 X 7 mils while the bidirectional PLED511 is 9.5 X 9.5 mils excluding scribe area. Minimum BV is 5.7V and stand off voltage is 4.7V. Maximum leakage current is 1 microampere for the PLED508 and the PLED511. Capacitance is 15pF for the PLED508 and PLED511.

The unidirectional PLED508U size is 6.5 X 6.5 mils while the unidirectional PLED511U is 10.5 X 10.5 mils, excluding scribe. Minimum BV is 6.0V and stand off voltage is 5V. Maximum leakage current is 0.5 microampere for the PLED511U and 0.1 microampere for the PLED508U while capacitance is 80pF for both. The back metal for the all PLED wafers is Ti/Ni/Ag and the top metal is Al/Cu. All PLED wafers are also 6 mils thick.

Pricing and availability

Minimum order quantities are the equivalent of five whole wafers (quartered) and are delivered in individual boxes. The PLED511 has 200,000 diodes; the PLED511U has 150,000; the PLED508 has 300,000 and the PLED508U has 340,000 per wafer. Pricing is one cent per die and all wafer options are now available in mass quantities.

More information is available at



October 23, 2012