Skyworks Solutions, Inc. today announced that it has launched a breakthrough front-end system that integrates all RF and analog content between the transceiver and antenna for simplified design within demanding next generation mobile platforms. Leveraging Skyworks' silicon integration expertise, advanced manufacturing technologies and proprietary techniques, SkyOneT is the world's first semiconductor device to condense multiband power amplifiers and high throw switches along with all associated filtering, duplexing and control functionality into a single, ultra-compact package---all in less than half the area of the industry's most advanced approach. At the same time, this groundbreaking solution provides the world's best linearity and power added efficiency (PAE) for smart RF integration. As a result, SkyOneT offers smartphone, tablet and ultrabook OEMs significant board space savings, ease of implementation, performance and time to market advantages.
Even as radio content and complexity continue to rise, consumers are demanding increasingly thinner and lighter mobile platforms with increased talk/data access time. To meet this challenge, SkyOneT optimizes performance beyond what is possible with less integrated devices and incorporates all popular 2G, 3G and 4G/LTE protocols enabling seamless global network roaming and extended battery life.
Skyworks' SkyOneT family of FEMs integrate the following in a single package:
• 2G / 3G / 4G power amplifiers
• Support for bands 1, 2, 3, 4, 5, 7, 8, 13, 17 and 20
• Quad band GSM/EDGE power amplifiers and filters
• All associated duplexer functionality
• Integrated CMOS switches and control functions
• DCS/PCS Rx filters
SkyOneT enhances the carrier connectivity experience independent of operator or region. Future devices will leverage the best of new process, circuit design and advanced interconnect technology to create further disruptive improvements in size, performance and band integration.
Posted by Sara Cohen, Editorial Intern
June 26, 2012