Ohmite Manufacturing Company announces that the Ohmite C Series heatsink now supports most resistor package sizes from TO-126 to TO-264. Ideal for high power density and small size (1U or 2U) electronic packaging with forced convection cooling, this powerful heatsink provides tool and fixture free assembly operation, large surface area, and small space occupation.
In March 2011, Ohmite first introduced the C Series heatsink system with integrated camming clips to secure TO-247 devices. Ohmite’s new C Series heatsink features modified clips to attach smaller devices (TO-126), as well as additional fins for improved cooling. The standard product is offered in two finishes, degreased and black anodized. Customers can customize this heatsink with longer lengths and additional clips to secure multiple devices.
As with all C Series heatsinks, the integrated clip eliminates the need for hand tools or screw holes and minimizes assembly cost and time. These patented camming clips all offer maximum repeatability, providing a constant spring force even after repeated assembly/disassembly. The resilient spring action locks the component in place securely.
Posted by Sara Cohen, Editorial Intern
June 12, 2012