TE Connectivity will be featuring many new next-gen connector technologies at this year’s MILCOM.
MULTIGIG RT2 – This backplane connector family is the high reliability standard for VXS (VITA 41) and VPX (VITA 46) architectures. The connector features 10Gbps performance and is focused on reducing SWaP, with mechanical and electrical CAD models posted and ready for download.
Quadrax – The D-Sub style connector for military and commercial aerospace environments was designed to provide a gigabit Ethernet solution in an industry standard D-Sub platform, while offering superior shielding performance.
MIL-STD 1554 Data bus system – Used in MIL-STD-1553B multiplexing applications, data bus system provides high packaging density, weight savings, design flexibility and high performance to 150 degree C.
Fortis Zd – This advanced high-speed backplane connector, designed for military and commercial aerospace applications, supports increasing bandwidth requirements in a ruggedized format to withstand the increased shock and vibration requirements of emerging military applications.
ARINC 801 – Optical termini for use with GPR, ARINC 600, circular MIL-DTL-38999 connectors that have an industry standard 1.25mm ceramic ferrule.
Mezalok – A high-reliability mezzanine connector that more than doubles the speed and durability of competing technology, making it the most viable option for today’s military and commercial aerospace applications.
VITA 62 Power Connector – Based on TE Connectivity's MULTIBEAM XLE product line, the VITA 62 connector expands the power handling capacity in VPX architectures, with configurations to support both 3U and 6U VITA 62 power supplies.
VITA 67 RF Module – These modules enhance the ability to add RF capabilities in VITA 46 VPX board-to-board connections, which are compatible with VITA 65 OpenVPX specification.
More information on TE Connectivity can be found at www.te.com.
Posted by Janine E. Mooney, Editor
November 8, 2011