"The Helios NanoLab DualBeam provides the SEM and FIB performance needed to solve some of the critical roadblocks to advancing technology and sciences across many disciplines," said John Williams, vice president of marketing, FEI. "It has been adopted by leading semiconductor manufacturers for their most advanced research and development needs; it is being used by major academic and industrial research laboratories for advanced material characterization and modification down to the single nanometer scale; and it has even expanded into the life sciences and oil & gas industries due to its ability to provide three-dimensional imaging at the nanoscale."

Latest Helios NanoLab x50 DualBeam Series is the most powerful and versatile DualBeam system available on the market today. It integrates FEI's high-resolution scanning electron microscope (XHR SEM) with a new, high-performance focused ion beam (FIB), to deliver an unprecedented level of imaging and milling capability.

Customers across a variety of industries have had great success with the DualBeam's unique set of capabilities in a variety of applications, including:

* academic and industrial research centers use the Helios NanoLab system for advanced 2D and 3D materials characterization, leading-edge sample preparation and nanoprototyping of nanoscale prototypes of electronic, optical, and mechanical devices

* advanced semiconductor fabs are using the system for fast and precise preparation of ultrathin samples for transmission electron microscope (TEM) analysis

* life scientists can view features of interest in tissue and cells three dimensionally, using the Helios system's "slice and view" (3D reconstruction) capability

* and the oil & gas industry is using the Helios to optimize and extract natural gas that is hidden in many unconventional reservoirs, such as tight sands, gas shales and coalbed methane.