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As DC-DC applications, such as power modules, telecommunications and servers, become more space-constrained, designers are looking for smaller devices to meet their design challenges. The thermal capability of these devices, however, is a concern.

In order to meet the needs for high current capability, high efficiency and smaller form factors, Fairchild Semiconductor developed the Dual Cool™ packaging for MOSFETs. The Dual Cool package is a top-side cooling PQFN device that incorporates new packaging technology which enables additional power dissipation through the top of the package.

Dual Cool packaging features an exposed heat slug that delivers a significant reduction in thermal resistance from junction to top of case, resulting in more than 60 percent higher power dissipation capability than standard PQFN packaging when a heat sink is mounted. Additionally, MOSFETs in the Dual Cool package are designed with Fairchild’s proprietary PowerTrench® process technology, that enables lower RDS(ON) and higher load currents in smaller package sizes.

Unlike competitive top-side cooling solutions, these devices are currently available in both Power33 (3.3 mm x 3.3 mm) and Power56 (5 mm x 6 mm) Dual Cool packaging options. Maintaining the same industry-standard PQFN footprint, the Dual Cool package allows power engineers to rapidly qualify MOSFETs in Dual Cool packaging, gaining increased thermal efficiency without having to adjust for non-standard packages.

Devices currently available in the Dual Cool package include the FDMS2504SDC, FDMS2506SDC, FDMS2508SDC, FDMS2510SDC (5 mm x 6 mm footprint) and the FDMC7660DC (3.3 mm x 3.3 mm footprint). These devices are ideal as synchronous rectifying MOSFETs for DC-DC converters, telecom secondary side rectification and high end server/workstation applications. Fairchild’s Dual Cool packaged MOSFETs’ top-side cooling and an ultra-low junction temperature (Rthja) enable increased thermal efficiency. MOSFETs in the Dual Cool package can be used with or without a heat sink.

For additional information on devices available in the Dual Cool package, please visit our website at:

www.fairchildsemi.com/dualcool

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