Amkor is now entering the second generation for Package on Package (PoP) applications where new memory architectures required in mobile multimedia applications, demand higher density stacked interfaces in combination with PoP mounted area and height reductions. After three years of development, Amkor introduced the next generation PoP solution with new technologies to create interconnect vias through the mold cap, naming this technology through mold via (TMV™). TMV™ technology provides a stable bottom package that enables use of thinner substrates with a larger die to package ratio. TMV™ enabled PoP can support single, stacked die or FC designs. TMV™ is an appropriate solution for the emerging 0.4mm pitch low power DDR2 memory interface requirements and enables the stacked interface to scale with solder ball pitch densities to 0.3mm pitch or below. The next few years promise to provide many new challenges and applications for PoP, as handheld multimedia applications continue to demand higher signal processing power and data storage capabilities.