Fairchild Semiconductor announces the 100, 200 and 220 V N-channel UltraFET devices available in ultra-compact (3 mm × 3 mm) molded leadless packages (MLP). These devices are suitable for primary-side switches in isolated DC/DC converter applications, such as work stations, telecom and networking equipment, where improving system efficiency and saving board space are mandatory design goals. Fairchild’s 200 V device, the FDMC2610, boasts the industry’s lowest Miller charge (3.6nC vs. 4nC) and the lowest on-resistance (200mΩ vs. 240mΩ) when compared with similar 200 V MLP 3ࡩ devices on the market. These characteristics result in a 27% better Figure of Merit (FOM) and translate into superior thermal and switching performance in DC/DC converter applications. The 200 V device also offers best-in-class thermal resistance (Theta JC) compared with similarly packaged devices (3C/W vs. 25C/W), a heat-dissipating feature that ensures reliability even in demanding environments.