Rogers Corporation has introduced its RO4450B-dx Bondply, a high fill/flow version of the industry standard RO4450B high frequency circuit material. It is a glass-reinforced hydrocarbon/ceramic thermoset bondply that is designed for performance-sensitive, multilayer printed circuit boards. The result is a low loss material that can be fabricated using standard epoxy/glass (FR4) processes. The RO4403, RO4450B, and RO4450B-dx prepregs are based upon the RO4000 series core materials, and they are compatible in multilayer constructions with either RO4003C or RO4350B laminates. As with RO4000 laminates, RO4400 prepregs are compatible with the majority of standard FR4 processing practices.