Semtech Corporation introduces the µClampP, a low-voltage, four-line electrostatic discharge (ESD) protection device that features packaging and design innovations for a small size and simplified board layout. The µClamp3324P is a 3.3 V device that comes in Semtech’s SLP2116P8 leadless package, which measures 2.1 × 1.6 × 0.58 mm. The device has a flow-through design that enables it to be used near connectors simplifying board design when compared to competitive multi-line ESD protection devices that require significant board redesign. The µClamp3324P replaces four discrete devices such as multilayer varistors, reducing the space needed for ESD protection by 77%. Internally, the device is constructed using the company’s patented EPD TVS process technology yielding true 3.3 V operating devices. Designed for cell phones, digital still cameras, notebook computers and other portable systems, the µClamp3324P provides low working and clamping voltage for protection of sensitive ICs in high ESD threat environments. The leadless design along with a large ground pad at the bottom of the device reduces the parasitic inductance, for better IC protection.