Olympus Integrated Technologies America’s AL series optical inspection and defect review system delivers wafer edge and bevel inspection. Its full bevel inspection will allow the user to see the top, side, and bottom of the wafer from various angles using a continuous angle adjustment for best imaging and defect detection. This will maximize the user’s ability to detect particles, pits and residues that lead to hot spots on the front side, chips, cracks, and scratches that cause wafer breakage, and edge bead removal issues that not only harm the individual wafer, but can result in equipment and wafer cross contamination. Defect information and images are stored in a common defect format for tracking and yield analysis. The systems include a variety of visible light imaging methods using Olympus Universal Infinity Systems (UIS) infinity corrected optics for good imaging and resolution.
Olympus Integrated Technologies America, Inc.