AdTech Ceramics has published a design guide for advanced electronic packages produced with co-fire multi-layer ceramic technology. Typical applications include multi-chip modules, microwave packages, high frequency feed-throughs, crystal packages, custom pin grid arrays, and ceramic/metal packages. The guide includes a basic process overview and ceramic specifications for HTCC and AlN to assist in materials selection. Structural and metallization interconnect capabilities are shown with appropriate tolerances. Also discussed is the design of special features and components for highly custom applications.
Advanced Technical Ceramics Company