The ZigBee™ Alliance has ratified the first ZigBee specification, making the development and deployment of power efficient, cost effective, low data rate monitoring, control, and sensing networks a reality. This on-time delivery of the specification is the culmination of two years of worldwide development and interoperability testing by the more than 100 member companies of the ZigBee Alliance.

TeleCIS Wireless Completes $4M Million Financing Round

TeleCIS Wireless, Inc. announces that the company has raised a second round of funding totaling $4 million, bringing the company's total venture funds raised to $8.7 million. ATA Ventures of Redwood City, California, led the Series B round. The funding will serve to augment the company's existing revenues from the licensing of its WLAN (802.11) chipset Intellectual Property and allow the company to continue its expansion into the WiMAX (802.16) System-on-a-Chip sector.

Atmel and Thales Navigation Sign Technology Agreement

Atmel® Corporation and Thales Navigation business have signed a technology agreement, under which the two companies will partner in the development and marketing of state-of-the-art Global Positioning System (GPS) chipsets, subsystems, and associated software. Under the agreement, Atmel will sell a GPS chipset solution currently used in the Magellan® eXplorist™ recreational GPS handheld from Thales which was jointly developed by Atmel and Thales.

Merrimac Reports Transfer of Stock

Infineon Technologies AG sold an aggregate of 475,000 shares of the Common Stock of Merrimac Industries, Inc. to four purchasers in a privately-negotiated transaction. Infineon also assigned to each purchaser certain registration rights to such shares under existing registration rights agreements Infineon had with Merrimac.

American Microwave Announces Certification

American Microwave Corporation announces that they are now ISO9001:2000 Certified.

Elcoteq and Thomson Enter Outsourcing Agreement

Elcoteq Network Corporation reaches an agreement for its largest outsourcing and acquisition to date with Thomson, a leading provider of technology, systems, and services to integrated media and entertainment companies. The deal includes the acquisition of Thomson’s manufacturing operation in Juarez, Mexico, and manufacturing cooperation in the set-top box business.

Semiconductor To Power Its Next Generation Of SoC

Atmel® Corporation announces the completion of a licensing agreement with National Semiconductor Corporation for a Gigabit Ethernet Physical Layer Core. The core will be used by Atmel to design next generation server connectivity products and highly integrated System-on-Chip products.

Eagleware Purchases Elanix

Elanix announces that it has been purchased by Eagleware Corporation. Eagleware is a leading provider of high frequency design tools for RF and microwave products. The combined companies offer complementary products for communication system design from concept to implementation. All Elanix employees are being hired by Eagleware, and will continue to support the EDA community from the Westlake Village office. Eagleware has committed resources to support and enhance SystemView and to integrate SystemView with the Eagleware product line.

Wavesat Announces Partnership with EDOM

Wavesat announces a strategic partnership with EDOM Technology Co., Ltd. for the distribution of its chips in Taiwan. This partnership will better serve their customers in the region and help bring low cost WiMAX subscriber units to market by Q2 2005.

Ember and Mototech To Offer Design and Manufacturing Services

Companies who have been unable to tap into the lucrative ZigBee market for wireless control and monitoring products due to a lack of design and manufacturing capabilities now have a way to outsource their design and manufacturing needs, thanks to a partnership announced between Ember Corporation and Mototech, a high-tech ODM/OEM powerhouse located at Science-Based Industrial Park in Taiwan.

Australian Government Supports Mimix Broadband's Collaborative Research

Mimix Broadband, Inc. and Macquarie University have recently been awarded more than US$500K in research funding under the Australian Research Council's (ARC) Linkage-Projects Scheme, which seeks to encourage and develop long-term strategic research alliances between higher education institutions and industries. Through 2007, ARC will fund AUS$640K to the project, which will include two Australian Postgraduate Award (PhD) researchers and a Post Doctoral researcher.

InterDigital Enters Agreement with General Dynamics

InterDigital announces that they have entered into an agreement with General Dynamics to deliver 3G wireless technologies for use in the Mobile User Objective System (MUOS) advanced communications military program. The company expects to receive $18.5 million for delivery and license of its commercial technology solution, maintenance, and product training for use within the government’s MUOS and Joint Tactical Radio Systems programs.

Helicomm Announces Agreement with Silicon Laboratories

Helicomm announces that Silicon Laboratories has licensed Helicomm’s ZigBee-based IP-Net™ networking software, and that the companies have entered into a ZigBee Joint Development and Marketing Agreement.

BFi OPTiLAS and XMA Sign Distribution Agreement

XMA Corporation and BFi OPTiLAS announce the signing of a distribution agreement. Under terms of the agreement, BFi OPTiLAS will distribute XMA’s full line of standard RF & microwave components including terminations, attenuators, and other passive products in the European markets.

Connor-Winfield Purchases AG Communication’s Manufacturing Facility and Assets

The Connor-Winfield Corporation announces that it is purchasing from AG Communication Systems (AGCS) its manufacturing facility in Genoa, Illinois. AGCS is a wholly owned subsidiary of Lucent Technologies Inc. (Lucent) and in April, 2004, Lucent announced the facility would close. The terms of the transaction between Connor-Winfield and AGCS were not disclosed.

Cardinal Components Announces Partnership

Cardinal Components Inc. announces its latest distribution partnership with Dependable Component Supply. DCS has been in business for over 16 years and distributes a wide range of electronic components from crystals and oscillators to integrated circuits. DCS is headquartered in Deerfield Beach, Florida.

Richardson’s Interconnect Group Signs Distribution Agreement with Fractus

Richardson Electronics announces it has signed a distribution agreement with Fractus, a pioneer developer and manufacturer of antennas for the telecommunications, electronics and military industries. Under the terms of the agreement, Richardson will operate as a global distributor for Fractus’ complete line of embedded antennas for short-range wireless applications, filling a need in Richardson’s components solutions line card. Richardson’s product offering will now encompass an array of components for the emerging Broadband Wireless Access market to accommodate WiFi, WiMAX, Zigbee, and Bluetooth® technologies.

Henkel Announces Opening of Research and Applications Center

The electronics group of Henkel announces the opening of its Research and Applications Center. The 53,000 square foot state-of-the-art facility in Irvine, CA will house R&D and applications engineering for the company’s die attach, semiconductor underfill, encapsulant, and semiconductor mold compound products. The facility is the new global headquarters for the electronics group of Henkel and marks the first official opening of several planned new worldwide facilities for the electronic materials leader.

austriamicrosystems and Nu Horizons Announce Distribution Partnership Agreement

austriamicrosystems AG and Nu Horizons Electronics Asia Pte. Ltd. announce a partnership agreement to distribute austriamicrosystems’ ASSP and Standard Linear IC products throughout Asia Pacific.

Spectrum Delivers Development Platforms to US Defense Contractor

Spectrum Signal Processing Inc. announces that an unnamed US defense contractor has purchased two SDR-3000 MRDP platforms for use in its internal military communications research and development programs. The order is the first design-in for Spectrum's flexComm™ SDR-3000 MRDP, a rapid-prototyping development platform designed for military communications (MILCOM) applications, following its introduction in November 2004.

Olympus-ITA to Supply Wafer and Defect Review Systems to Major Integrated Device Manufacturer

Olympus Integrated Technologies America (ITA), a subsidiary of Olympus Corporation of Japan announces an agreement with one of the world’s largest US integrated device manufacturers (IDMs). Under the agreement, the IDM will purchase additional 300 mm wafer inspection systems from Olympus. The first order for Olympus’ AL3100 systems was in Q1 2004, with the second order delivered at the end of 2004. The systems will provide both inspection and defect review capabilities.

XEMICS SA Launches Hong Kong Branch Office

XEMICS SA announces its expanded presence in the Asia Pacific market. XEMICS’ new Asia Pacific branch office will be based centrally in the heart of Hong Kong. The Asian branch office’s primary goal is to intensify sales and marketing activities in South East Asia. At present, the Asian market accounts for 20% of XEMICS’ sales turnover. With this expansion, the company is aiming to increase that figure to 30% by the end of 2005. By being on-site, the Asian Branch Office can provide Asian customers with full services and application support.