M/A COM introduces an addition to its line of packageless SURMOUNT PIN diodes. The MA4SPS552 has applications in handsets, WLAN products, instrumentation, and military control applications operating between 0.5 GHz and 26 GHz. The diode features a 0201 footprint and is produced using a Vertical Etch Technology. A DC bias current will operate the devices with 2 mA. The series is manufactured on the company's HMIC silicon glass process to enable the integration of silicon PIN diodes with low dispersion, low-loss glass for two terminal or multi-port devices.
M/A COM Inc.