To meet growing demand in the wireless radio frequency integrated circuit (RFIC) market for a capable, cost-effective RFIC design platform, Applied Wave Research, Inc. (AWR(), a leading provider of high-frequency electronic design automation (EDA) tools, today announced a corporate agreement with Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) to jointly develop and deliver a design platform for TSMC's 0.35-micron silicon germanium (SiGe) process.
AZIMUTH SIGNS WITH PARALINK, TOYO
Azimuth Systems, Inc., innovators in scalable, automated wireless network test systems, today announced that it has signed distribution agreements with Toyo Corporation, Japan's top distributor of networking equipment and network test solutions, and with Paralink, the leading provider to China and Taiwan of innovative network testing tools and advanced technology solutions. With the agreements, Azimuth becomes the leading provider of wireless network testing and performance validation solutions to the world's most rapidly-growing market
CSI Wireless Receives $18 Million in Purchase Orders for its TDMA Fixed Wireless Telephone
CSI Wireless Inc., a designer and manufacturer of advanced wireless and GPS products used in more than 40 countries, today announced that it has received purchase orders totaling $18 million from Brightstar Corporation, a Motorola licensee, for CSI's TDMA-based fixed wireless telephone known as the Motorola FX800t. Shipments under these orders will be made throughout the third quarter and completed in the fourth quarter of this year.
Elcoteq to Build a New Plant in St. Petersburg, Russia
The Board of Directors of Elcoteq Network Corporation, global provider of electronics manufacturing services (EMS) for the Communications Technology Industry and the largest European electronics EMS provider, announced its plan to build a new plant in St. Petersburg, Russia. Construction of the plant, with an area of 14,700 square meters (158,000 square feet), is expected to begin in the final quarter of 2004, and to be in operation in the fall of 2005.
Phoenix Contact Inc. Acquires Entivity, Inc.
Phoenix Contact Inc. today announced the acquisition of Ann Arbor, MI based Entivity, Inc. The acquisition of Entivity provides Phoenix Contact with a USA based software resource and the products and know how to meet control software applications based on PC based technologies. The installation of Entivity products on Phoenix Contact hardware platforms will provide PC functionality in embedded form factors, allowing for a much greater range of applications. Phoenix Contact has been working closely with Entivity on joint products and customer solutions since November 2002 and informally since the inception of Entivity.
Artimi Secures $14 Million in Series A Funding
Artimi Inc., a fabless semiconductor company developing Ultra Wideband (UWB) silicon solutions, announced today that it has closed a $14 million Series A funding round. Index Ventures co-led the round with Accel Partners and Amadeus Capital Partners Ltd and investment from Oak Investment Partners.
ACCESS Partners with Datang to Power 3G Data Services in China
ACCESS, a global provider of Internet access technologies, today announced that ACCESS has partnered with Datang Mobile Communications Equipment Co., Ltd. (Datang), to provide the enabling technology for advanced mobile services over TD-SCDMA networks. Datang of China is a leading mobile technology provider and the creator of TD-SCDMA, China's homegrown 3G standard.
Approval of Landmark IEEE Security Standard Enables Wireless LAN Vendors to Add Stronger Encryption to Product Portfolios
Trapeze Networks(tm), the award-winning provider of the wireless LAN (WLAN) Mobility System(tm), today announced that the proposed IEEE 802.11i specification was approved as an amendment to the 802.11 standard on June 24, 2004 during an IEEE-SA standards board meeting.
Atmel Signs Agreement to Become Second-Source Supplier for Cypress's WirelessUSB(tm) Technology
Cypress Semiconductor Corp. and Atmel® Corp. (NASDAQ: ATML) today jointly announced that Atmel will manufacture and sell chips based on Cypress's industry-leading 2.4 GHz WirelessUSB technology. WirelessUSB chips are currently used in low-data rate wireless devices, such as PC keyboards, mice and video game controllers, and are being designed into a wide array of applications, including remote controls, toys and sensors.
MICRON ANNOUNCES PLANS TO PRODUCE NAND FLASH MEMORY PRODUCTS
Micron Technology, Inc., today announced plans to produce NAND Flash memory solutions targeting memory cards, USB devices and other mass storage applications. The growing demand for high-performance, low-cost flash solutions in mobile applications positions NAND Flash as the fastest-growing semiconductor segment in the market. As a leading supplier of semiconductor memory products, Micron is committed to meeting its customers' NAND memory requirements.
Sierra Wireless and Audiovox expand relationship with new orders for 1xEV-DO PC Cards
Sierra Wireless (NASDAQ: SWIR - TSX: SW) announced today the receipt of new orders from Audiovox Communications Corporation (ACC), a subsidiary of Audiovox Corporation (Nasdaq: VOXX), for an additional supply of PC5220 Wireless Wide Area Network (WWAN) 1xEV-DO PC Cards. The new orders total approximately $29 million with deliveries to begin in the third quarter of 2004. The PC5220 PC Card, manufactured by Sierra Wireless, works with laptops and provides mobile professionals with wireless data access to e-mail, the Internet and corporate applications via a third generation (3G) wide-area CDMA2000® 1xEV-DO network.
TechnoConcepts To Acquire G2 Software Systems, Inc.
TechnoConcepts, Inc., developers of True Software Radio (TSR) technology that, when fully implemented, solves a critical limitation of existing software defined radio solutions and allows different wireless protocols to communicate directly with each other, today announced that it has signed an agreement to acquire G2 Software Systems, Inc. Terms were not disclosed, however the acquisition is expected to be immediately accretive to TechnoConcepts, Inc.
TECOM Industries Wins Missile Defense Agency Contract for Phase I Small Business Innovative Research (SBIR) Program
TECOM Industries, Inc., a Smiths Interconnect company, announced today that the Missile Defense Agency has awarded a competitive contract for Phase I Small Business Innovative Research (SBIR) Program to conduct research and development for Electronically Steerable Integrated Flight Intercept Control Station (IFICS) Data Terminal Antennas.
New UMTS Products to be Based on TI's OMAP(tm) 2 Architecture and NTT DoCoMo's W-CDMA Technology
Texas Instruments Incorporated (TI) (NYSE:TXN) and NTT DoCoMo, Inc., announced today a joint agreement to develop a cost-competitive, multi-mode UMTS (W-CDMA/ GSM/GPRS) chipset to serve the Japanese, U.S. and worldwide 3G handset market. This collaboration further strengthens a long-standing relationship between the two industry leaders to drive the faster market adoption of 3G handsets. An integrated UMTS digital baseband and applications processor will be developed based on TI's OMAP 2 architecture and NTT DoCoMo's W-CDMA technology for NTT DoCoMo handsets and other 3G handsets worldwide. Additionally, the agreement will include development and testing of power management, RF and protocol software that will be made available as system solutions to TI's worldwide customer base.
Cranite and Vivato Team Up to Deliver Broadest Range and Most Secure Wireless Networking Solution Available
Cranite Systems, Inc., and Vivato today announced a strategic partnership to provide their customers with government-certified secure wireless network solutions, offering the broadest range and most secure wireless networking solutions available.
Winegard to Form a New Mobile Internet Antennae Systems Company
Winegard Company, an innovative and pioneering business with more than 50 years experience in the design, manufacture and development of antennae technology, has recently established DATA TECH, LLC, a new company dedicated to mobile Internet antennae products.
WJ Communications Announces Completion of Acquisition
WJ Communications, Inc., a leading designer and supplier of high-performance RF semiconductors and multi-chip modules (MCM), announced today that it has completed its previously announced acquisition of the infrastructure business and associated assets of privately-held EiC Corporation (EiC) of Fremont, CA. EiC designs, develops, manufactures and markets proprietary radio frequency integrated circuits (RFICs) primarily for wireless communications products.
Eagleware and Sonnet Announce Partnership
Eagleware Corporation, a leading provider of high-frequency design software for the RF and microwave engineers, and Sonnet® Software, Inc., a leading provider of high-frequency planar electromagnetic (EM) analysis software, today announced a partnership to develop, market and service the integration of Sonnet's EM simulation products into the popular GENESYS design environment. Included in the partnership are provisions to share licenses and to train their respective teams to support their common customer base. The formation of partnerships such as the one Eagleware and Sonnet announce today advances the strategy of both companies to support interoperability and open systems in high-frequency design automation. Such agreements allow engineers to use complementary products to create a fully integrated design flow for design and simulation.
California Micro Devices Announces Foundry Agreement with SANYO
California Micro Devices today announced that it had entered into a wafer supply agreement with SANYO Electric Co., Ltd. This agreement establishes SANYO as a high volume manufacturing site for California Micro Devices' Application Specific Integrated Passive( (ASIP() devices and analog semiconductors. This move expands the wafer capacity available for building the company's products designed for the mobile, computing and digital consumer markets.
Zeevo and SMART Modular Technologies, Inc. Collaborate on Advanced Bluetooth Modules for Embedded Communications and Quality Wireless Audio Applications
Zeevo, Inc., a leading provider of single-chip Bluetooth communications solutions and the leading provider of transceiver chips for quality audio over Bluetooth, jointly announced today with SMART Modular Technologies, Inc., a leading provider of wireless modules, that the two companies have entered into a strategic alliance to develop and sell Bluetooth modules into the embedded Bluetooth solutions market, as well as into the accelerating audio-over-Bluetooth market. The modules will be based upon announced and future Zeevo Bluetooth chips. Bluetooth is the increasingly prevalent standard for the wireless transmission of data between personal-use devices and their peripherals, such as cell phones to wireless headsets, or wireless keyboards and mice to personal computers.
Ansoft Corporation First Quarter Results: 19% Increase In Revenue
Ansoft Corporation (NASDAQ: ANST) today announced financial results for its first quarter of fiscal 2005 ended July 31, 2004. Revenue for the first quarter totaled $12.7 million, an increase of 19% compared to $10.7 million reported in the previous fiscal year's first quarter. Net income for the first quarter was $30,000, or $0.00 per diluted share, as compared to a net loss of $1.2 million, or ($0.10) per diluted share in the previous fiscal year's first quarter
SiRF Multimode Location Technology Powers Next-Generation LBS Platform
SiRF Technology Holdings, Inc. (NASDAQ: SIRF), a leading provider of GPS-enabled silicon and software location platforms, today announced the signing of a licensing and co-marketing agreement with SK Telecom Co., Ltd. of Seoul, Korea to enable wider deployment of location based services (LBS) worldwide. Under the terms of the agreement, SiRF and SK Telecom agree to create and jointly market to operators worldwide a new LBS platform based on SiRF's patented, multimode A-GPS SiRFLoc(TM) Server Engine and SiRFLoc Client software. As part of the agreement to support the next generation of LBS applications, SK Telecom will introduce multiple handsets using SiRF's landmark SiRFstarIII(TM) architecture.
Peregrine Semiconductor Unveils 0.25µm UltraCMOS Process for High-Performance RF and Mixed-Signal IC Manufacturing
Peregrine Semiconductor Corporation, a leading supplier of high-performance RF CMOS and mixed-signal communications ICs, today announced its new 0.25µm UltraCMOS Silicon-on-Sapphire process technology is available for foundry services. Two new processes, designated as GA and GC, complement the existing 0.50µm FA and FC processes and will push the transistor performance beyond the 100 GHz F(max) mark. The initial 0.25µm offering will be available on a quarterly basis beginning fourth quarter of 2004 through the widely popular Multi-Project Runs (MPR). Peregrine's foundry engineering group provides all the essential design support service, including a complete Cadence-based front-end to back-end Process Design Kit (PDK) at no cost, under NDA, to prospective customers. Customers may purchase a tile area of 3mm by 3mm on a shared mask set and receive a minimum 50 sawn dice.