To comply with the Restriction of Hazardous Substances (RoHS) Directive and other worldwide initiatives for lead-free manufacturing, Advanced is offering lead-free solder ball terminal options on select BGA sockets. The sockets are molded from high temperature, glass filled thermoplastic, able to withstand the higher processing temperatures required in lead-free processing (up to 276° C). The 1.00 mm pitch BGA sockets in precision molded LCP wafers for both surface mount and thru-hole applications are available now. The surface mount sockets feature solder ball terminals made from a tin/silver/copper alloy with a reflow temperature of 218° C. The full grid wafers are pin loaded to the footprint specified and are available in any footprint specific pattern up to 26 × 26 rows, to accommodate a BGA, LGA, or CSP device as large as 27 mm square.
Advanced Interconnections Corporation