STMicroelectronics (NYSE:STM) announces triple-band GSM/GPRS transceiver modules packaged in a 1.4 × 7 × 7 mm low-profile ball grid array package. The modules require a 26 MHz crystal and a power amplifier to build a complete triple-band solution from antenna to baseband interface. Two versions are offered: type STw3100 addresses the European EGSM900, DCS1800, and PCS1900 bands while the STw3101 targets the US GSM850, DCS1800, and PCS1900 bands. The transceiver modules are compatible with STM's power-amplifier module and most of the standard power amplifiers available on the market. The foundation of these modules is an integrated chip containing the transmitter, receiver, LNA, VCO, DCXO, and synthesizer block. Around this chip the modules also integrate the receive bandpass filters, RLC components for matching, phase-locked loop filtering, decoupling, and DC blocking functions.