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RF Micro Devices introduces its family of linear power amplifier modules for CDMA applications, including 3 V IS-95/CDMA 2000 1X handheld digital cellular equipment and spread-spectrum systems. Measuring 3 × 3 × 0.9 mm, the RF3163, RF3164, and RF3165 PA modules are manufactured on a GaAs HBT process and are based upon RFMD's patent pending Lead Frame Module (LFM) packaging technology. Products designed using LFM technology do not require laminate or LTCC substrates or surface mount components.The PA modules feature MSM-driven digital control lines to lower quiescent current for increased talk time in low power conditions. Self-contained with 50Ω input and output, the modules are internally matched for power, efficiency, and linearity.

RF Micro Devices, Inc.

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