Advanced Interconnections introduces 1.00 mm pitch BGA sockets in precision molded wafers. The sockets are molded in-house from high temperature thermoplastic. Benefits include reduced insertion and withdrawal forces and coplanarity within .006 inches. The full grid wafers are pin loaded to the footprint specified and are available in any footprint specific pattern up to 26 × 26 rows, to accommodate a BGA, LGA, or CSP device as large as 27 mm square. The surface mount sockets utilize patented eutectic solder ball terminals. Thru-hole models are available with a variety of terminal options including the popular .011 inches diameter tail. The sockets have screw-machined terminals with multifinger contacts. The sockets mate with the company's 1.00 mm pitch BGA adapters and are also designed for test applications, enabling a thru-hole test socket to be plugged and unplugged for use on multiple test boards.