Schroff® introduces its third generation of the 14-slot AdvancedTCA system, suitable for telecom and networking applications including wireless IP, telephony, and optical switches. The system's backplane is available in a variety of topologies including full mesh, dual star, and dual dual star. The system is designed to meet all NEBS requirements, and addresses thermal management, shelf management, and serviceability issues. With three independent fan trays, all field replaceable, and each with dual cooling pathways, the system provides cooling to the slots even in the event of a fan failure. The system incorporates two integrated shelf manager/fan controllers, based on Pidgeon Point technology, to provide redundancy as well as thermal and system management, combining these functions on one board.