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Now in its 11th year, the KGD Packaging and Test Workshop has become the leading source for the latest information on test, assembly, manufacturing, and business issues for semiconductor die products. The 2004 Workshop will "Focus on Final Manufacturing" by spotlighting technologies that are emerging today to support the market demands for stacked packages, wafer level packages, and bumped or bare die.

The 3-day workshop will again feature innovative technical sessions, free pre-workshop tutorials, and an exhibit of world-class materials and equipment suppliers.Technical sessions and tutorials will focus on topics such as wafer thinning, probe testing, die handling, wirebonding, high density substrate fabrication, package stacking, SiP testing of stacked packages containing logic, memory and rf chips.

http://www.napakgd.com

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