Dymax introduces the line of Multi-Cure thermally conductive adhesives. These materials are suitable for bonding heat sinks or heat sensitive components to printed circuit boards. The UV curing option for fillets and encapsulants provides curing in 10 seconds or less at room temperature. Room temperature activator cure of adhesive between two surfaces provides fixturing in 30 to 45 seconds. One component heat curing at 150°C in 10 to 15 minutes or 120°C in 20 to 30 minutes is also possible.
www.dymax.com; (877) DYMAX-UV