Technical Research and Manufacturing (TRM) announces ultra low profile dividers and combiners to facilitate packaging density. The Airstrip( technology allows for a low profile, mechanically stacked assembly that is suited for use in high density, low profile phased array antenna systems associated with military, space or commercial applications. The use of blind mate connectors provides for mating ease of multiple ports simultaneously. The approach affords the ability to mechanically stack several individual divider layers together without any tolerance limitation. TRM supplies stacks of 24 individual 12-way dividers in an area of 6.4 × 1.7 × 1.8 inches and weighing less than 420 grams.
www.technicalresearch.com; (603) 627-6000