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Xemics announces their power CODEC device XE3005, available in a Chip Scale Package (Ultra CSP). The Ultra CSP is a wafer level packaging technology using standard equipment to produce a thin-film, solderable redistribution layer. The XE3000 series of devices operates down to 1.8 V, consumes less than 600 μA during full operation and offers a full duplex PCM and SPI interface. p> B>url>www.xemics.com; +41 32 720 5562/url>/B>/t1>

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