CoolFin heat sinks from Molex( (the 37430 series) are designed to provide cooling for Pentium( 4 FMB2 microprocessors at speeds of 3.06 GHz and higher. The CoolFin heat sink features stamped fins that are linked together and soldered to a base plate. The inner fins, which sit directly above the heat source, are made of copper for maximum thermal efficiency. The outer fins are made of aluminum to reduce weight. CoolFin technology offers a range of choices in fin pitch, geometry, material type and thickness.