RF Micro Devices announces the RF3146, the third-generation of the PowerStar GSM power amplifier (PA) modules with integrated power control. The RF3146 is designed using the Lead Frame Module (LFM) packaging technology. The RF3146 measures less than 50 mm2. The RF3146 is designed for use as the final RF amplifier in single- and multi-band GSM, DCS and PCS handheld digital cellular equipment and other applications in the 824 MHz to 849 MHz, 880 MHz to 915 MHz, 1710 MHz to 1785 MHz and 1850 MHz to 1910 MHz bands. The RF3146 is manufactured using GaAs HBT for the power amplifier and silicon CMOS for the integrated power control circuitry. The product is packaged in 7 × 7 × 0.9 mm leadless chip carrier.
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