Model 5060 Automatic Ball Bonder and Model 5070 Automatic Wedge Bonder offer large area, deep access, ball and wedge wire bonding for microelectronic packaging applications. They have a large 12 inches× 5 inches work area and are designed for ergonomic operation. The 5060 provides thermosonic ball and stitch bonding with a heated workstage and an optional capillary heater. Model 5070 provides ultrasonic or thermosonic wedge bonding with a heated workstage. It is capable of bonding with round wire or gold or aluminum ribbon.
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