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The 3470-II enables deep access wedge bonds across an area of 633 square inches, with 0.00025 inch accuracy, and excelent control and repeatability for bonding complex parts such as compact hybrids, MCM power connections, microwave devices, and microwave tuning. The 3470-II performs ultrasonic or thermosonic wedge bonding using an optional heated work stage. The DX-Y robotic positioners can move to any position within a 32.5 inches× 19.5 inches bonding envelope, accommodating both large and small microcircuit substrates and packages.

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