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These packages are designed for mixed signal devices such as MUX (multiplex), DAC (digital analog converters), ADC (analog digital converters), and track and hold chips for ultra wideband data acquisition. These packages maintain the electrical, thermal, and mechanical integrity of chips operating at speeds as high as 50 GHz or 40 Gbits/sec. Packages are available in StratEdge LCC (low cost commercial) and glass wall, flat pack, and are hermetically sealed.

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