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The 3500-II component assembly cell for MEMS packaging applications provides five micron accuracy placement in the X, Y, and Z axes, and .2 milliradians in Theta axis. It eliminates the need for human touch or handling of the devices. Presentation of the components for assembly is done in waffle paks or gel paks. The 3500-II can accommodate all types of attach methods including epoxy, eutectic soldering with tightly controlled heat regulation, thermocompression, and thermosonic bonding on gold ball bumps.
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