Taiyo Yuden introduced a small RF module for the next generation of Bluetooth-based wireless communications devices, including cell phones and PDAs. The ultra-compact RF module employs a unique LTCC (Low Temperature Co-fired Ceramics) substrate that is achieved by embedding the filter, inductors and capacitor into the substrate and using flip-chip assembly techniques to mount the semiconductor. Measuring 7.0 mm (0.276) L × 7.0 mm (0.276) W × 1.8 mm (0.071) H, the ultra-compact module incorporates a Silicon Wave RF chipset with superb high-frequency performance providing a Bluetooth 1.1-compliant Class 2 (max 4 dBm) output. To meet more stringent portable device power requirements, the module was designed to use one-third less power than other Bluetooth modules.
This robust, highly flexible customer solution offers full compliance to the Silicon Wave RF interface, the Blue-RF interface (the GSM and CDMA de facto standard) and others. It is designed to operate with various clock frequencies, the module allows true design flexibility by allowing the designer to use an existing application frequency, rather than change to suit the module.