The TB62731FU, white LED driver IC utilizes a current drive technology that maximizes operating efficiency and improves performance up to 20 percent. Because of this improvement, designers can choose between an up to 20 percent decrease in power consumption while maintaining LED emissions at the same level as in current products, or maintaining power consumption at present levels and boosting LED emissions up to 20 percent.
In addition, the white LED driver IC is also the first to adopt a driving current derating function with ambient temperature, which enables the driver IC to measure power consumption against heat maximizing LED performance in room temperature.
Toshiba's new TB62731FU white LED driver incorporates an internal switching N-channel metal-oxide field-effect-transistor (MOSFET) with a typical on resistance of 1.5 Ohm, contributing to an overall device efficiency of up to 90 percent using pulse mode or up to 85 percent using direct current drive. The TB62731FU white LED driver IC utilizes a newly developed current drive mode which enhances light emission efficiency by up to 85 percent at minimum power. This new methodology substantially eliminates series resistance that increases power consumption and enables the serial connection to turn-on in several white LEDs.
In addition, the white LED driver IC employs a temperature derating technology that predicts environmental temperature, including that from the driver IC itself, and optimizes light emission. The TB62731FU supports either direct-current turn-on mode or pulse-current turn-on mode, based on the application and LED characteristics. Adoption of pulse-current turn-on mode increases efficiency by requiring fewer rectifier diodes and condensers than director current mode and offers high efficiency white LED turn-on in high forward current.
By using the bi-cadmium (BiCD) process technology in the white LED driver IC, Toshiba has reduced the external component count, enabling the low power consumption required by portable and wireless communications devices, and simplifying the assembly of the package.