The amplifier design has provision for the operating bias point to be adjusted using an external control voltage. This allows the operating mode to be adjusted to provide better efficiency particularly when operating at reduced output power levels.
The silicon/silicon-germanium structure and the packaging with heatslug die pad provide high thermal conductivity and subsequent low junction temperature. This device is capable of operating with 100 percent duty cycle. Features include: single 3.3 V supply; 2400 - 2500 MHz operation; 8-lead MSOP plastic package; and bias control and powerdown mode. Applications include: Bluetooth; HomeRF; IEEE 802.11; WLAN; cordless phones; and ISM-band spread spectrum.