Vicor introduces a power system architecture based on power conversion technologies. The architecture, called Factorized Power Architecture (FPA), is enabled by power conversion components called VI chips or VICs. VI chips process up to 200 watts of power in a 0.25 cubic inch power Ball Grid Array (BGA) package. Power density is up to 800 watts/in3. These blocks will be deployed as surface mount components to create a flexible Factorized Power System.