The UltraCool III line allows for a high degree of customization. Varying parameters include footprint, pin height, base thickness, pin density and material (copper or aluminum). UltraCool III heat sinks for digital components range from a footprint of 0.3 in. × 0.3 in. to 2.5 in. × 2.5 in. and from a height of 0.2 in. to 1.3 in. An infinite number of combinations within these limits are feasible.
UltraCool III heat sinks are applicable for ASICs, routers, processors, power regulators, DC to DC converters, video and audio processing chips and other "hot" components. They could be attached to packages such as the SOP and SOJ types, BGA, PBGA, QFP, PQFP, PGA, PPGA, and PLCC.