Published on Wireless Design and Development (https://www.wirelessdesignmag.com)

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Ultra Miniature 9800 Relay

Coto Technology is now utilizing a higher temperature solder & solder paste for internal connections on its ultra-miniature 9800 series Surface Mount Relays. The solder alloy, Sn95/Sb5, allows for a maximum board reflow temperature of 226 ° C for one minute as measured at the component leads. This compares to 221 ° C for the Sn100 solder previously used. This latest product improvement addresses the need for keeping internal reflow temperatures as high as possible to better unsure the connection integrity of the relay.
Content Item Type: 
Product Announcement [1]
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http://www.wirelessdesignmag.com/product-releases/2001/04/ultra-miniature-9800-relay
Summary: 
Coto Technology is now utilizing a higher temperature solder & solder paste for internal connections on its ultra-miniature 9800 series Surface Mount Relays. The solder alloy, Sn95/Sb5, allows for a maximum board reflow temperature of 226 ° C for one minute as measured at the component leads....
Legacy NID: 
34 700
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Source URL: https://www.wirelessdesignmag.com/product-releases/2001/04/ultra-miniature-9800-relay

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[1] https://www.wirelessdesignmag.com/content-item-types/product-announcement