The MHVIC910HR2 integrated circuit is designed for base stations, uses Motorola's newest high voltage LDMOS integrated circuit (HVIC)technology, and contains a three-stage amplifier. Target applications include macrocell (driver function) and microcell base stations (final stage). The device is packaged in a 16-pin Power Flat Pack (PFP-16) package, which gives excellent thermal performance through a solderable backside contact.
The PFP-16 is a high power surface mount package for radio frequency integrated circuits (RFICs). The PFP-16 is a RF specific package with two rows of eight leads and an exposed plated copper slug. It is especially suited for packaging of RF integrated power amplifiers, which have become common in wireless handsets.