The products include: a 15.1 × 13.9 × 2.2 mm, 0 dBm power RF module for cell phone applications; a 33.7 × 16 × 2.2 mm, 0 dBm device for PDA and handheld computing devices; and a 32 × 19.5 × 2.2 mm, 20 dBm for notebook and portable PC applications. All three comply with Bluetooth specification version 1.0b, operate in the 2.4 GHz band, and support both voice and data communications. The PDA and PC modules incorporate a radio and baseband core with built-in flash memory as well as USB high-speed and UART interfaces for communication capability with the "master" device.
The modules are built around an advanced chipset utilizing silicon-on-Insulator (SOI) BiCMOS process technology, which requires less than half the power of CMOS-based chips. Production costs are reduced by a baseband-to-RF signal direct conversion system, eliminating the need for SAW filters and LC passive filters, and resulting in modules that offer performance, size and cost benefits to OEM designers.