“The ConnectCore 3G provides an easy path for M2M device manufacturers to add Sprint 3G connectivity to their devices,” said Larry Kraft, senior vice president of global sales and marketing, Digi International. “And with the iDigi Device Cloud, device manufacturers can remotely configure, upgrade, monitor and troubleshoot their devices and create applications that improve customer service and increase revenue.”
“Collaborating with Digi International brings distinct enhancements to our M2M portfolio and Sprint’s focus on an Open-Network-Execution approach helps partners and customers benefit from M2M opportunities,” said Wayne Ward, vice-president –Sprint Emerging Solutions Group. “Our value proposition is built on streamlining the process of deploying M2M solutions, while enabling customers to tap into our extensive M2M ecosystem, where they can choose from a broad selection of applications and expertise to support their specific objectives."
The ConnectCore 3G features Qualcomm Gobi technology which supports High Speed Packet Access (HSPA) or Evolution-Data Optimized (EV-DO) networks from the same cellular radio. This allows customers to develop one solution for use anywhere in the world with the same hardware.
The iDigi Device Cloud makes it easy for ConnectCore 3G customers to configure and manage device deployments and integrate with customer applications. The module is programmable in iDigi’s application framework (iDigi Dia) and Python. Customized hardware and software development is also available through Digi’s Spectrum Design Services.
For more information about iDigi, visit www.idigi.com .
To learn more, view this special “What if ...” M2M video and visit www.sprint.com/m2m .
Posted by Janine E. Mooney, Editor
November 1, 2011