High-capacity test capabilities address next-generation test in R&D, manufacturing
Santa Clara, CA – Agilent Technologies (NYSE: A) has announced it will show its newest wireless design and test solutions that address present and future test technology challenges in LTE, LTE-A, and 3GPP, Releases 11 and 12, at Mobile World Congress, February 24-27, Barcelona, Spain.
The design and test solutions focus on the higher-capacity capabilities needed to address increased peak data rates with multiple technologies, including Carrier Aggregation, enhanced use of multi-antenna techniques, and enhanced uplink for next-generation wireless device R&D and manufacturing.
“Even as LTE and LTE-Advanced are being deployed, work is already starting on the successor, 5G,” says Benoit Neel, vice president and general manager, EMEA field operations, Agilent. “As we prepare to become Keysight Technologies and separate from Agilent later this year, the need for high-speed connectivity will be an ever-increasing denominator as we look ahead to 5G networks. We are committed to delivering the design and test solutions that will help achieve the ‘everything, everywhere,’ always-connected environment.”
Today the integration of all things wireless includes advanced car systems, which contain RF, wireless, millimeter-wave and high-speed digital technologies. Automotive communication and component test challenges now include 2/3/4G cellular, 802.11p WAVE, Bluetooth Low Energy and Near Field Communication (NFC). The technology offers huge benefits, such as blind-spot detection, emergency braking and real-collision protection to help drivers avoid potential risk and accidents, but it brings significant design and test challenges to automotive companies and ecosystem players.
For more information, please visit www.agilent.com.