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Cooling microprocessor chips through the combination of carbon nanotubes and organic molecules as bonding agents is a promising technique for maintaining the performance levels of densely packed, high-speed transistors in the future.

Read: Cooling Microprocessors with Carbon Nanotubes

From left, Brett Helms, Frank Ogletree and Sumanjeet Kaur at the Molecular Foundry used organic molecules to form strong covalent bonds between carbon nanotubes and metal surfaces, improving by six-fold the flow of heat from the metal to the carbon nanotubes. (Photo by Roy Kaltschmidt)

For more information visit http://www.lbl.gov.

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