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NEW YORK, /PRNewswire/ -- Components suppliers are ramping up for commercial production of an array of products that will enable the telecom industry's migration to packet-optical transport systems (P-OTS) over the next five years, according to the latest edition of Heavy Reading Components Insider (www.heavyreading.com/commchip), a paid research service of Heavy Reading (http://www.heavyreading.com/).

“Chip Makers Gear Up for Packet-Optical Deployments” analyzes ongoing developments for integrated packet-optical devices and OTN framer/mapper devices and technologies, identifying the key requirements and highlighting the advantages they hold for equipment manufacturers. It includes detailed information on component availability, reviewing features, performance, and flexibility. The report covers more than 30 devices and profiles 12 vendors in this important market sector.

"Packet-optical transport is a key focus for telecom equipment providers and carriers alike, and highly integrated semiconductor devices are needed to deliver the benefits expected by carriers," says Simon Stanley, research analyst for Heavy Reading Components Insider and author of the report. "Five leading telecom semiconductor vendors are making significant investments in this market: PMC-Sierra has an early lead with HyPHY devices now sampling to customers, but new devices from AppliedMicro, Exar, Cortina, and Vitesse are due to start sampling toward the end of 2010 and early 2011."

Time to market, flexibility, and integration will be key parameters as telecom equipment providers choose their next-generation packet-optical transport technology, Simon adds. "The winners will be those that can show market-leading performance and integration for 10-Gbit/s and 40-Gbit/s devices today and a clear roadmap for 100-Gbit/s devices within one to two years," he predicts.

Key findings of Chip Makers Gear Up for Packet-Optical Deployments include the following:

* Packet-optical transport platforms (P-OTP) are a key focus for telecom equipment providers and carriers.

* Highly integrated ASSP devices are now in development and shipping from multiple vendors.

* 40nm technology enables micro optical transport platforms (u-OTP) on a chip.

* 100-Gbit/s ODU4 devices are in development by multiple vendors, with the first silicon expected in 2011.

For a complete list of companies covered in this report, please see:

http://img.lightreading.com/cci/pdf/cci0910_companies.pdf

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